Abstract
This paper presents a design optimization method based on theoretical analysis and numerical calculations, using a commercial multi-physics solver (e.g., ANSYS and ESI CFD-ACE+), for a 3D continuous model, to analyze the bending characteristics of an electrically heated bimorph microcantilever. The results from the theoretical calculation and numerical analysis are compared with those measured using a CCD camera and magnification lenses for a chip level microcantilever array fabricated in this study. The bimorph microcantilevers are thermally actuated by joule heating generated by a 0.4 μm thin-film Au heater deposited on 0.6 μm Si₃N₄ microcantilevers. The initial deflections caused by residual stress resulting from the thermal bonding of two metallic layers with different coefficients of thermal expansion (CTEs) are additionally considered, to find the exact deflected position. The numerically calculated total deflections caused by electrical actuation show differences of 10%, on average, with experimental measurements in the operating current region (i.e., ~25 mA) to prevent deterioration by overheating. Bimorph microcantilevers are promising components for use in various MEMS (Micro-Electro-Mechanical System) sensing applications, and their deflection characteristics in static mode sensing are essential for detecting changes in thermal stress on the surface of microcantilevers.