Results of an interlaboratory study on the working curve in vat photopolymerization.

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作者:Kolibaba Thomas J, Killgore Jason P, Caplins Benjamin W, Higgins Callie I, Arp Uwe, Miller C Cameron, Poster Dianne L, Zong Yuqin, Broce Scott, Wang Tong, Talačka Vaidas, Andersson Jonathan, Davenport Amelia, Panzer Matthew A, Tumbleston John R, Gonzalez Jasmine M, Huffstetler Jesse, Lund Benjamin R, Billerbeck Kai, Clay Anthony M, Fratarcangeli Marcus R, Qi H Jerry, Porcincula Dominique H, Bezek Lindsey B, Kikuta Kenji, Pearlson Matthew N, Walker David A, Long Corey J, Hasa Erion, Aguirre-Soto Alan, Celis-Guzman Angel, Backman Daniel E, Sridhar Raghuveer Lalitha, Cavicchi Kevin A, Viereckl R J, Tong Elliott, Hansen Christopher J, Shah Darshil M, Kinane Cecelia, Pena-Francesch Abdon, Antonini Carlo, Chaudhary Rajat, Muraca Gabriele, Bensouda Yousra, Zhang Yue, Zhao Xiayun
The working curve informs resin properties and print parameters for stereolithography, digital light processing, and other photopolymer additive manufacturing (PAM) technologies. First demonstrated in 1992, the working curve measurement of cure depth vs radiant exposure of light is now a foundational measurement in the field of PAM. Despite its widespread use in industry and academia, there is no formal method or procedure for performing the working curve measurement, raising questions about the utility of reported working curve parameters. Here, an interlaboratory study (ILS) is described in which 24 individual laboratories performed a working curve measurement on an aliquot from a single batch of PAM resin. The ILS reveals that there is enormous scatter in the working curve data and the key fit parameters derived from it. The measured depth of light penetration D(p) varied by as much as 7x between participants, while the critical radiant exposure for gelation E(c) varied by as much as 70x. This significant scatter is attributed to a lack of common procedure, variation in light engines, epistemic uncertainties from the Jacobs equation, and the use of measurement tools with insufficient precision. The ILS findings highlight an urgent need for procedural standardization and better hardware characterization in this rapidly growing field.

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