Robust ultrahigh electromagnetic interference shielding effectiveness based on engineered structures of carbon nanotube films.

High-performance electromagnetic interference (EMI) shielding materials with ultrathin, flexible, and pliable mechanical properties are highly desired for high-end equipments, yet there remain large challenges in the manufacture of these materials. Here, carbon nanotube film (CNTF)/copper (Cu) nanoparticle (NP) composite films are fabricated via a facile electrodeposition method to achieve high electromagnetic shielding efficiency. Notably, a CNTF/Cu NP composite film with 15 μm thickness can achieve excellent EMI shielding efficiency of ∼248 dB and absolute EMI shielding effectiveness as high as 2.17 × 10(5) dB cm(2) g(-1), which are the best values for composite EMI shielding materials with similar or greater thicknesses. These engineered composite films exhibit excellent deformation tolerance, which ensures the robust reliability of EMI shielding efficiency after 20,000 cycles of repeated bending. Our results represent a critical breakthrough in the preparation of ultrathin, flexible, and pliable shielding films for applications in smart, portable and wearable electronic devices, and 5G communication.