Corrosion Acceleration of Printed Circuit Boards With an Immersion Silver Layer Exposed to Bacillus cereus in an Aerobic Medium

在有氧介质中,浸渍银层印刷电路板暴露于蜡样芽孢杆菌后腐蚀加速。

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Abstract

In this research, the corrosion behavior of printed circuit boards with an immersion silver layer (PCB-ImAg) exposed to Bacillus cereus bacteria in Luria-Bertani broth was investigated. The growth test demonstrated that B. cereus had a high copper tolerance. Analysis of surface and cross-sectional view of the samples after immersion test indicated that metabolites produced by B. cereus accelerated the microporous corrosion of PCB-ImAg, and the biofilm that adhered to the surface led to oxygen concentration corrosion. Electrochemical impedance spectroscopy tests confirmed that the microbiologically influenced corrosion of PCB-ImAg was related to the biofilm formation and metabolism.

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