Abstract
For the first time, we demonstrate the hybrid integration of dual distributed feedback (DFB) quantum cascade lasers (QCLs) on a silicon photonics platform using an innovative 3D self-aligned flip-chip assembly process. The QCL waveguide geometry was predesigned with alignment fiducials, enabling a sub-micron accuracy during assembly. Laser oscillation was observed at the designed wavelength of 7.2 μm, with a threshold current of 170 mA at room temperature under pulsed mode operation. The optical output power after an on-chip beam combiner reached sub-milliwatt levels under stable continuous wave operation at 15 °C. The specific packaging design miniaturized the entire light source by a factor of 100 compared with traditional free-space dual lasers module. Divergence values of 2.88 mrad along the horizontal axis and 1.84 mrad along the vertical axis were measured after packaging. Promisingly, adhering to i-line lithography and reducing the reliance on high-end flip-chip tools significantly lowers the cost per chip. This approach opens new avenues for QCL integration on silicon photonic chips, with significant implications for portable mid-infrared spectroscopy devices.