Multi-scale characterization of bamboo bonding interfaces with phenol-formaldehyde resin of different molecular weight to study the bonding mechanism

通过多尺度表征不同分子量酚醛树脂与竹材的粘合界面,研究其粘合机理。

阅读:1

Abstract

Understanding the bonding mechanism of the interfacial region between bamboo and adhesives is essential for accelerating the development of improved adhesives for advanced bamboo-based materials. In this study, Br-labelled phenol-formaldehyde (PF) resins with four different molecular weights (MWs) were used to make bamboo-adhesive interfaces for tracing the adhesives in bamboo. Ultra-depth-of-field microscopy and scanning electron microscopy in conjunction with energy dispersion spectrometry were used to access the distribution and penetration of resin in the bamboo polymer. Fourier transform infrared images and solid-state cross-polarization/magic angle spinning nuclear magnetic resonance spectra were used to access the molecular-scale interactions between PF resins and bamboo cell walls. The results showed that the PF resins with high MW infiltrated into the lumina of damaged bamboo cells near the bondline to form glue nails, while those with low MW penetrated into the bamboo cell wall to form nanomechanical interlocking. Chemical bonds and secondary forces such as polar forces and hydrogen bonds were generated between bamboo and PF resin. Finally, the twice-adhesive dispensing method combining low-MW resins with high-MW resins was used to improve the bonding strength of the interface.

特别声明

1、本页面内容包含部分的内容是基于公开信息的合理引用;引用内容仅为补充信息,不代表本站立场。

2、若认为本页面引用内容涉及侵权,请及时与本站联系,我们将第一时间处理。

3、其他媒体/个人如需使用本页面原创内容,需注明“来源:[生知库]”并获得授权;使用引用内容的,需自行联系原作者获得许可。

4、投稿及合作请联系:info@biocloudy.com。