Abstract
Glass-ceramic optical components are extensively employed in advanced optical systems. The high-hardness and low-fracture toughness of glass-ceramics make it prone to cracks and subsurface damage during conventional cutting. The laser-assisted diamond cutting method can significantly improve the nano-cutting performance of glass-ceramics by locally heating and softening the material. However, its dynamic removal mechanisms remain unclear. The coupling mechanisms between the laser thermal field and the mechanical response of the material require further investigation. This study aims to reveal the dynamic removal mechanisms of glass-ceramics under laser-assisted nanoscale cutting conditions through numerical simulations and systematic experiments. It includes a systematic analysis of the effects of laser heating on chip morphology, temperature fields, stress fields, and cutting forces using a laser-assisted nano-cutting model. Additionally, through nanoscale taper cutting experiments, this study quantifies the enhancement effect of laser power on the critical depth of no observed surface cracks (NOSC). Finally, subsurface integrity results elucidate the mechanisms through which laser assistance inhibits crack propagation. The findings will provide theoretical support for optimizing laser-assisted cutting parameters and achieving high-quality machining of glass-ceramics.