Abstract
Direct-write vapor deposition is a new technique that would enable one-step 3D maskless nanofabrication on a variety of substrates. A novel silicon chip-based microevaporator is developed that allows evaporant to exit through 2000-300 nm nozzles while held at distances comparable to the nozzle diameter from the substrate by a three-axis nanopositioning stage in vacuum. This results in a localized deposition on the substrate, which may be scanned relative to the substrate to produce direct-write patterns. The performance of the microevaporator is tested by creating localized depositions of various materials and the line-writing potential is demonstrated. The relationship between linewidth and source-to-substrate distance is investigated by the application of Knudsen's cosine law and Monte-Carlo simulations, and then utilized to approximate the source-to-substrate distance from performed depositions.