Abstract
Transfer printing, a crucial technique for heterogeneous integration, has gained attention for enabling unconventional layouts and high-performance electronic systems. Elastomer stamps are typically used for transfer printing, where localized heating for elastomer stamp can effectively control the transfer process. A key challenge is the potential damage to ultrathin membranes from the contact force of elastic stamps, especially with fragile inorganic nanomembranes. Herein, we present a precision-induced localized molten technique that employs either laser-induced transient heating or hotplate-induced directional heating to precisely melt solid gallium (Ga). By leveraging the fluidity of localized molten Ga, which provides gentle contact force and exceptional conformal adaptability, this technique avoids damage to fragile thin films and improves operational reliability compared to fully liquefied Ga stamps. Furthermore, the phase transition of Ga provides a reversible adhesion with high adhesion switchability. Once solidified, the Ga stamp hardens and securely adheres to the micro/nano-membrane during the pick-up process. The solidified stamp also exhibits the capability to maneuver arbitrarily shaped objects by generating a substantial grip force through the interlocking effects. Such a robust, damage-free, simply operable protocol illustrates its promising capabilities in transfer printing diverse ultrathin membranes and objects on complex surfaces for developing high-performance unconventional electronics.