Abstract
Copper-based coatings are known for their high antibacterial activity. In this study, nanocomposite Cu-Sn-TiO(2) coatings were obtained by electrodeposition from an oxalic acid bath additionally containing 4 g/dm(3) TiO(2) with mechanical and ultrasonic agitation. Ultrasound treatment was performed at 26 kHz frequency and 32 W/dm(3) power. The influence of agitation mode and the current load on the inclusion and distribution of the TiO(2) phase in the Cu-Sn metallic matrix were evaluated. Results indicated that ultrasonic agitation decreases agglomeration of TiO(2) particles and allows for the deposition of dense Cu-Sn-TiO(2) nanocomposites. It is shown that nanocomposite Cu-Sn-TiO(2) coatings formed by ultrasonic-assisted electrodeposition exhibit excellent antimicrobial properties against E. coli bacteria.