Abstract
Carbon dioxide (CO(2)) laser is widely used in commercial and industrial fields to process various materials including polymers, most of which have high absorptivity in infrared spectrum. Thin-film processing by the continuous wave (CW) laser is difficult since polymers are deformed and damaged by the residual heat. We developed the new method to make polypropylene (PP) and polystyrene (PS) sheets thin. The sheets are pressed to a Cu base by extracting air between the sheets and the base during laser processing. It realizes to cut the sheets to around 50 µm thick with less heat effects on the backside which are inevitable for thermal processing using the CW laser. It is considered that the boundary between the sheets and the base is in thermal equilibrium and the base prevents the sheets from deforming to support the backside. The method is applicable to practical use since it does not need any complex controls and is easy to install to an existing equipment with a minor change of the stage.