Abstract
To develop a facile method for reducing the coefficient of volumetric thermal expansion (CVE) of polymer films, the thermal expansion behaviors of thermally cross-linkable polyimide (PI) films with isomeric diamine structures were investigated via thermal mechanical analyses and optical interferometry measurements. The degree of crosslinking of the PI films containing the diphenylethynylene (Ph⁻C≡C⁻Ph) structure in the main chain was characterized by far-infrared (far-IR) spectra and density functional theory (DFT) calculations, and variations in the CVE induced by thermal crosslinking were quantitatively estimated. The crosslinking reactions effectively reduced the CVEs of the PI films by suppressing intermolecular free volume expansion and local molecular motions promoted at elevated temperatures. The lowest CVE value observed for a crosslinked PI cured at 400 °C (+98 ppm/K at 80⁻280 °C) was one of the smallest values reported to date in polymers. Incorporating interchain crosslinking into the main chain is an effective method for reducing the CVE of aromatic polymers.