A promising structure for fabricating high strength and high electrical conductivity copper alloys

一种用于制造高强度、高电导率铜合金的有前景的结构

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作者:Rengeng Li, Huijun Kang, Zongning Chen, Guohua Fan, Cunlei Zou, Wei Wang, Shaojian Zhang, Yiping Lu, Jinchuan Jie, Zhiqiang Cao, Tingju Li, Tongmin Wang

Abstract

To address the trade-off between strength and electrical conductivity, we propose a strategy: introducing precipitated particles into a structure composed of deformation twins. A Cu-0.3%Zr alloy was designed to verify our strategy. Zirconium was dissolved into a copper matrix by solution treatment prior to cryorolling and precipitated in the form of Cu5Zr from copper matrix via a subsequent aging treatment. The microstructure evolutions of the processed samples were investigated by transmission electron microscopy and X-ray diffraction analysis, and the mechanical and physical behaviours were evaluated through tensile and electrical conductivity tests. The results demonstrated that superior tensile strength (602.04 MPa) and electrical conductivity (81.4% IACS) was achieved. This strategy provides a new route for balancing the strength and electrical conductivity of copper alloys, which can be developed for large-scale industrial application.

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