Decoupling thermal stability and insulation in dielectric polymers via donor-acceptor rearrangement

通过供体-受体重排实现介电聚合物热稳定性和绝缘性的解耦

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Abstract

Polymer dielectrics with enhanced thermal stability and electrical insulation are urgently needed for capacitive energy storage applications in electric power systems. There is a persistent challenge to break the contradictory correlation between high heat resistance and low electrical conduction in polymers. Here, we employ benzyl-induced crosslinking to rearrange short-range structural units in polyimide chains, reducing electrical conduction loss. The designed polymer exhibits an electrical conductivity more than 3 orders of magnitude lower than that of commercial heat-resistant polymers, while its glass transition temperature (T(g)) increases from 236.31 °C (for polyetherimide) to 289.72 °C. Consequently, a discharged energy densities of 6.38 J cm(-3) and 3.04 J cm(-3), with charge-discharge efficiencies above 90%, are achieved at 200 °C and 250 °C, respectively, demonstrating among the best in all-organic dielectric polymers. This work presents a feasible approach to break the adverse correlation between thermal stability and electrical insulation in polyimide materials.

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