Abstract
Non-destructive and accurate characterization of high aspect ratio (HAR) and composite micro-trenches is critical for advanced microfabrication but remains a major challenge. Conventional coherence scanning interferometry (CSI), while widely adopted, suffers from low signal-to-noise ratio (SNR) and limited lateral resolution when applied to HAR and composite microstructures. Here, we present Fourier ptychographic coherence scanning interferometry (FP-CSI), the first transmissive CSI modality that integrates the aperture synthesis strategy of Fourier ptychographic microscopy with the quantitative phase-resolved capability of interferometry. FP-CSI enables robust three-dimensional morphology reconstruction with enhanced SNR and improved lateral resolution, without reliance on iterative phase retrieval. We demonstrate accurate measurements of a HAR micro-trench (300 μm depth, 30:1 aspect ratio) and micro-electro-mechanical system (MEMS) devices (aspect ratios 6:1-20:1). FP-CSI achieves lateral resolution up to the incoherent diffraction limit and maintains this performance even at trench bottoms. Owing to its fidelity, robustness, and non-destructive operation, FP-CSI provides a powerful new metrology platform for next-generation semiconductor inspection, precision manufacturing, and emerging micro-optoelectronic systems.