Abstract
Laser trepan drilling and laser helical drilling are typical methods for fabrication of micro through-holes through scanning laser beam. In the drilling process, the subsequent laser pulse may be occluded by the edge and the sputter deposition at the edge of the previous drilled trench. Dynamic focus feeding and widening path can be employed to lessen the occlusion effect and both of them are always employed in laser helical drilling. However, Widening the trench needs to remove more volume of material and may bring certain negative effects such as lowering the recoil pressure as well as less splashing melt due to the limited constraint of trench wall. The effects of dynamic feeding the focal plane and widening the scanning path on the quality and efficiency in the nanosecond laser drilling process were investigated through laser drilling holes with diameter of 500 μm on a 300 μm thick GH4169 plate. Results show that dynamic focus feeding is beneficial in both drilling efficiency and drilling quality. Through laser helical drilling with dynamic focus feeding, micro through-hole can be fabricated in 5 s, and both smaller tilting angle of 0.073 rad and smaller heat-affected zone of 0.63 mm in radius can be obtained. Widening scanning path is helpful to perforating rapidly but leads to much more recast layer coating. the quality of the micro through-holes depends not only on the utilization efficiency of the laser energy, but also on high temperature spatter deposition, which is the source of the difference between different drilling strategies. Due to the low cost in equipment and the better hole quality, the laser drilling, especially laser helical drilling, has potential applications ranging from aerospace fields to normal fields such as the agricultural machinery industry.