Abstract
This paper innovatively proposes a high-precision fabrication strategy for silicon-based micro-nano-composite layered structures composed of micron-scale platforms and nanopillars, effectively addressing the challenges of alignment errors and material mismatch during manufacturing. By integrating electron beam lithography (EBL), inductively coupled plasma (ICP) etching, and ultraviolet nanoimprint lithography (NIL) into a unified multi-step workflow, the method achieves exceptional precision and efficiency in producing complex micro-nano-composite architectures. Comprehensive structural characterization is performed using scanning electron microscopy (SEM) and atomic force microscopy (AFM), with probe convolution effects carefully corrected to ensure accurate dimensional analysis. Experimental results confirm the outstanding stability and uniformity of the fabricated structures, exhibiting minimal deviations in both feature size and spatial layout. Nanopillars with diameters ranging from 50 to 200 nm are successfully integrated onto 1-µm square platforms, with the lateral deviation of 50 nm features maintained within 5% or less. Furthermore, the method effectively mitigates thermal stress-induced misalignment during the fabrication of multi-material layers, demonstrating strong potential for scalable production of advanced photonic devices and integrated nanophotonic systems. Overall, this work establishes a robust and versatile technical pathway for the precise manufacturing and quantitative characterization of micro-nano-composite structures, providing a key foundation for the next generation of photonic integration technologies.