Abstract
The wettability of molten glass powder plays an essential role in the encapsulation of microelectromechanical system (MEMS) devices with glass paste as an intermediate layer. In this study, we first investigated the flow process of nano glass powder melted at a high temperature by simulation in COMSOL. Both the influence of the different viscosity of hot-melt glass on its wettability on SiO(2) and the comparison of the wettability of hot-melt glass on Au metal lead and SiO(2) were investigated by simulation. Then, in the experiment, the hot-melt glass flew and spread along the length of the Au electrode because of a good wettability, resulting in little coverage of the hot-melt glass on the Au electrode, with a height of only 500 nm. In order to reduce the wettability of the glass paste on the Au electrode, a SiO(2) isolation layer was grown on the surface of golden lead by chemical vapor deposition. It successfully reduced the wettability, so the thickness of the hot-melt glass was increased to 1.95 μm. This proved once again that the wettability of hot-melt glass on Au was better.