Abstract
Thermal management using a vapor-liquid two-phase circulation system is challenging in compact and complex-shaped electronic devices. In this study, we design and fabricate a heat pipe that can adapt to various shapes, regardless of space constraints. The heat pipe is capable of bending or twisting in three dimensions, making it suitable for electronic devices of arbitrary shapes. It effectively transfers heat from in-plane chips to out-of-plane spaces through flexible circulation pathways. This two-phase heat cycle system achieves an ultra-high thermal conductivity of up to 11,363 W/m·K. The flexible and adaptive design strategy enables efficient heat transfer in complex and compact environments.