Abstract
An innovational self-reduction molecular-level-mixing method was proposed as a simplified manufacturing technique for the production of carbon nanotube copper matrix composites (CNT/Cu). Copper matrix composites reinforced with varying amounts of (0.1, 0.3, 0.5 and 0.7 wt%) carbon nanotubes were fabricated by using this method combined with hot-pressing sintering technology. The surface structure and elemental distribution during the preparation of CNT/Cu mixing powder were investigated. The microstructure and comprehensive properties of the CNT/Cu composites were examined by metallography, mechanical and electrical conductivity tests. The results revealed that the CNT/Cu could be produced by a high temperature reaction at 900 degrees under vacuum, during which the carbon atoms in the carbon nanotubes reduced the divalent copper on the surface to zero-valent copper monomers. The decrease in the ratio of D and G peaks on the Raman spectra indicated that the defective spots on the carbon nanotubes were wrapped and covered by the copper atoms after a self-reduction reaction. The prepared CNT/Cu powders were uniformly embedded in the grain boundaries of the copper matrix materials and effectively hindered the tensile fracture. The overall characteristics of the CNT/Cu composites steadily increased with increasing CNT until the maximum at 0.7 wt%. The performance was achieved with a hardness of 86.1 HV, an electrical conductivity of 81.8% IACS, and tensile strength of 227.5 MPa.