Abstract
Acoustic tweezers, as advanced micro/nano manipulation tools, play a pivotal role in biomedical engineering, microfluidics, and precision manufacturing. However, piezoelectric-based acoustic tweezers face performance limitations due to multi-physical coupling effects during microfabrication. This study proposes a novel approach using injection molding with embedded electronics (IMEs) technology to fabricate piezoelectric micro-ultrasonic transducers with micron-scale precision, addressing the critical issue of acoustic node displacement caused by thermal-mechanical coupling in injection molding-a problem that impairs wave transmission efficiency and operational stability. To optimize the IME process parameters, a hybrid multi-objective optimization framework integrating NSGA-II and MOPSO is developed, aiming to simultaneously minimize acoustic node displacement, volumetric shrinkage, and residual stress distribution. Key process variables-packing pressure (80-120 MPa), melt temperature (230-280 °C), and packing time (15-30 s)-are analyzed via finite element modeling (FEM) and validated through in situ tie bar elongation measurements. The results show a 27.3% reduction in node displacement amplitude and a 19.6% improvement in wave transmission uniformity compared to conventional methods. This methodology enhances acoustic tweezers' operational stability and provides a generalizable framework for multi-physics optimization in MEMS manufacturing, laying a foundation for next-generation applications in single-cell manipulation, lab-on-a-chip systems, and nanomaterial assembly.