The New Technologies Developed from Laser Shock Processing

激光冲击加工技术发展而来的新技术

阅读:2

Abstract

Laser shock processing (LSP) is an advanced material surface hardening technology that can significantly improve mechanical properties and extend service life by using the stress effect generated by laser-induced plasma shock waves, which has been increasingly applied in the processing fields of metallic materials and alloys. With the rapidly development of modern industry, many new technologies developed from LSP have emerged, which broadens the application of LSP and enriches its technical theory. In this work, the technical theory of LSP was summarized, which consists of the fundamental principle of LSP and the laser-induced plasma shock wave. The new technologies, developed from LSP, are introduced in detail from the aspect of laser shock forming (LSF), warm laser shock processing (WLSP), laser shock marking (LSM) and laser shock imprinting (LSI). The common feature of LSP and these new technologies developed from LSP is the utilization of the laser-generated stress effects rather than the laser thermal effect. LSF is utilized to modify the curvature of metal sheet through the laser-induced high dynamic loading. The material strength and the stability of residual stress and micro-structures by WLSP treatment are higher than that by LSP treatment, due to WLSP combining the advantages of LSP, dynamic strain aging (DSA) and dynamic precipitation (DP). LSM is an effective method to obtain the visualized marks on the surface of metallic materials or alloys, and its critical aspect is the preparation of the absorbing layer with a designed shape and suitable thickness. At the high strain rates induced by LSP, LSI has the ability to complete the direct imprinting over the large-scale ultrasmooth complex 3D nanostructures arrays on the surface of crystalline metals. This work has important reference value and guiding significance for researchers to further understand the LSP theory and the new technologies developed from LSP.

特别声明

1、本页面内容包含部分的内容是基于公开信息的合理引用;引用内容仅为补充信息,不代表本站立场。

2、若认为本页面引用内容涉及侵权,请及时与本站联系,我们将第一时间处理。

3、其他媒体/个人如需使用本页面原创内容,需注明“来源:[生知库]”并获得授权;使用引用内容的,需自行联系原作者获得许可。

4、投稿及合作请联系:info@biocloudy.com。