The Impact of Light-Curing Time on Shear Bond Strength and Adhesive Remnant Index (ARI)

光固化时间对剪切粘接强度和粘合剂残留指数(ARI)的影响

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Abstract

Background/Objectives: The performance of the adhesive system used for bonding fundamentally influences the success of fixed orthodontic treatment. To withstand masticatory forces and prevent bracket debonding, it is critical to achieve optimal shear bond strength (SBS), improving treatment time. The aim of this study was to compare the shear bond strength and adhesive remnant index (ARI) of orthodontic brackets bonded using LED light-curing units with intensities of 3200 mW/cm(2) at two different exposure times, evaluated after 24 h and 14 days. Methods: Eighty extracted permanent premolars were randomly divided into four experimental groups. Brackets were bonded using Transbond XT adhesive and cured with a VALO™ Ortho Cordless unit (3200 mW/cm(2)) for 3 or 6 s. SBS was measured using a universal testing machine, and the ARI was assessed under a stereomicroscope at 40× magnification. Results: Increased light intensity and longer curing time significantly improved SBS values. The highest bond strengths were observed in groups cured with 3200 mW/cm(2) for 6 s, after 14 days. ARI scores showed that longer curing reduced adhesive remnants on the enamel. Statistical analysis confirmed significant differences among groups. Conclusions: Therefore, clinicians may achieve better bonding performance and easier enamel clean-up by using high-intensity lights with adequate curing duration.

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