Reactive Magnetron-Sputtered Tantalum-Copper Nitride Coatings: Structure, Electrical Anisotropy, and Antibacterial Behavior

反应磁控溅射钽铜氮化物涂层:结构、电各向异性和抗菌性能

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Abstract

Tantalum nitride (TaN) coatings are valued for their hardness, chemical inertness, and biocompatibility; however, they lack intrinsic antibacterial properties, which limits their application in biomedical environments. Introducing copper (Cu) into the TaN matrix offers a potential solution by combining TaN's mechanical and chemical durability with Cu's well-documented antimicrobial action. This study explores how varying copper incorporation affects the structural, electrical, photocatalytic, and antibacterial characteristics of TaCuN multilayer films synthesized via reactive magnetron sputtering. Three thin TaCuN films were fabricated using a high-power reactive magnetron co-sputtering system, varying the Cu target power to control the composition. Structural and morphological analysis was performed using X-ray diffraction (XRD), scanning/transmission electron microscopy (STEM/TEM), and energy-dispersive X-ray spectroscopy (EDS). Electrical conductivity was studied along and across the film surfaces at temperatures ranging from 20 to 375 K using AC impedance spectroscopy. Optical and photocatalytic properties were assessed using UV-Vis spectroscopy and methylene blue degradation tests. Antibacterial activity against Staphylococcus aureus was analyzed under visible light using CFU reduction tests. XRD and TEM analyses revealed a multilayered four-zone architecture with alternating Ta-, Cu-, and N-rich phases and a dominant cubic δ-TaN pattern. The layers exhibited pronounced conductivity anisotropy, with in-plane conductivity (~10(3) Ω(-1) cm(-1)) exceeding cross-plane conductivity by ~10(7) times, attributed to the formation of a metallic conduction channel in the mid-layer. Optical spectra indicated limited light absorption above 300 nm and negligible photocatalytic activity. Increasing the Cu content substantially enhanced antibacterial efficiency, with the highest-Cu sample achieving 95.6 % bacterial growth reduction. Morphological evaluation indicated that smooth film surfaces (Ra < 0.2 μm) effectively minimized bacterial adhesion. Reactive magnetron sputtering enables the precise engineering of TaCuN multilayers, combining high electrical anisotropy with robust antibacterial functionality. The optimized TaCuN coating offers promising potential in biomedical and protective applications where both conductivity and microbial resistance are required.

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