Abstract
This study presents a full-system simulation methodology for MEMS, addressing the critical need for reliable performance prediction in microsystem design. While existing digital tools have been widely adopted in related fields, current approaches often remain fragmented and focused on specific aspects of device behavior. In contrast, our proposed framework conducts comprehensive device physics-level analysis by integrating mechanical, thermal and electrical modeling with process simulation. The methodology features a streamlined workflow that enables direct implementation of simulation results into fabrication processes. We model a MEMS gyroscope as an example to verify our simulation approach. Multiphysics coupling is considered to capture real-world device behavior, followed by quantitative assessment of manufacturing variations through virtual prototyping and experimental validation demonstrating the method's accuracy and practicality. The proposed approach not only improves design efficiency but also provides a robust framework for MEMS gyroscope development. With its ability to predict device performance, this methodology is expected to become an essential tool in microsensor research and development.