Abstract
As electronic components progressively downsize and their power intensifies, thermal management has emerged as a paramount challenge. This study presents a novel, high-efficiency finned heat exchanger, termed Flat-Plate Oscillating Heat Pipe Finned Radiator (FOHPFR), which employs arrayed flat-plate oscillating heat pipes (OHP) as heat dissipation fins. Three-dimensional (3D)-printed techniques allow the internal microchannels of the FOHPFR to become rougher, providing excellent surface wettability and capillary forces, which in turn significantly improves the device's ability to dissipate heat. In this study, the 3D-printed FOHPFR is compared with traditional solid finned radiators made of identical materials and designs. The impacts of filling ratio, inclination angle, and cold-end conditions on the heat transfer performance of the 3D-printed FOHPFR are investigated. It is demonstrated by the results that compared to solid finned radiators, the FOHPFR exhibits superior transient heat absorption and steady-state heat transfer capabilities. When the heating power is set at 140 W, a decrease in thermal resistance from 0.32 °C/W in the solid type to 0.11 °C/W is observed in the FOHPFR, marking a reduction of 65.6%. Similarly, a drop in the average temperature of the heat source from 160 °C in the solid version to 125 °C, a decrease of 21.8%, is noted. An optimal filling ratio of 50% was identified for the vertical 3D-printed FOHPFR, with the minimal thermal resistance achieving 0.11 °C/W. Moreover, the thermal resistance of the 3D-printed FOHPFR is effectively reduced compared to that of the solid finned radiator at all inclination angles. This indicates that the FOHPFR possessed notable adaptability to various working angles.