Abstract
This study systematically investigated the influence of aging temperature variations on the evolution of Cu-rich precipitates and dislocation distribution characteristics in 17-4PH stainless steel through comprehensive electrochemical testing and microstructural characterization. The mechanism by which microstructural features govern electrochemical corrosion behavior was elucidated. Experimental results demonstrated that within the aging temperature range of 480-620 °C, matrix dislocations consistently maintained non-uniform distribution characteristics, though their regional heterogeneity exhibited a decreasing trend with increasing temperature. The precipitation behavior of copper followed an evolutionary sequence: transitioning from dispersed copper precipitates to finely distributed Cu-rich precipitates with high numerical density, ultimately progressing to coarsening and agglomeration. The corrosion resistance of the material initially improved before subsequent degradation, accompanied by a morphological transition of surface corrosion features from characteristic elongated striations to elliptical patterns. Samples aged at 580 °C for 4 h exhibited optimal corrosion resistance. Mechanistic analysis revealed that reduced dislocation density heterogeneity effectively minimized electrochemical potential differences between micro-regions, while elemental segregation induced by Cu-rich precipitates coarsening intensified local electrochemical inhomogeneity. These two mechanisms cooperatively regulated the overall corrosion resistance evolution of the material.