Abstract
The aim of this study was to clarify the influence of the copper surfaces changed from Cu or Cu(2)O to CuO on the bonding strength of resin with organic sulfur compounds. The disk-shaped specimens (n = 44) of copper were wet-ground. Half of the specimens were heated at 400 °C for 4 min in an electric furnace (HT: heated). Half of the specimens were not heated (UH: unheated). The specimens were further divided into two groups. Each group was primed by 6-methacryloyloxyhexyl 2-thiouracil-5-carboxylate (MTU-6) or unprimed (n = 11). A statistical analysis of the results of shear bond strength testing was performed, and the failure mode of the bonded areas was classified with an optical microscope. Two types of specimen surface (UH or HT) were analyzed chemically using X-ray photoelectron spectroscopy (XPS). When primed with MTU-6, unheated Cu (28.3 MPa) showed greater bond strength than heated (19.1 MPa). When unprimed, heated Cu (4.1 MPa) showed greater bond strength than unheated (2.3 MPa). The results of the debonded surfaces observation showed that only the UH-MTU-6 group demonstrated a combination of adhesive and cohesive failures in all specimens. The XPS results showed that the surface of copper changed from Cu or Cu(2)O to CuO when HT. These results confirmed that it is necessary to take care of the copper oxide contained in noble metal alloys when using organic sulfur compounds for adhesion.