Abstract
The aim of this study was to investigate the potential for co-bioleaching of ground printed circuit boards (PCBs) and flotation tailings using a single-stage biohydrometallurgical process. The ground PCB sample was a finely divided waste product from industrial shredding, which was collected using an air filtration system. The flotation tailings sample was mainly composed of pyrite (49%), quartz (29%), gypsum (8%), feldspar (8%), and chlorite (6%). The experiment was carried out in laboratory-scale reactors at 35 °C with constant aeration and a flotation tailings pulp density of 5% (solid-to-liquid ratio). In a control reactor, only flotation tailings were leached. In an experimental reactor, both flotation tailings and ground PCBs were leached simultaneously. The experiment was conducted in two stages. In the first stage, the experiment was carried out in a batch mode. The second stage involved two reactors operating continuously in cascade. During the experiment, we monitored the dynamics of several key parameters as a function of PCB concentration, including pH, redox potential, the concentrations of Fe(3+) and Fe(2+) ions, and the number of microbial cells. The 16S rRNA gene analysis revealed that the presence of PCBs had a significant effect on the composition of the microbial community. The concentration of PCB was gradually increased in order to examine the limits of the process and optimize potential economic benefits. The increase was done in 3 stages: 5 g/L in the first stage, from 5 to 12 g/L in the second stage, and up to 35.5 g/L in the third stage. However, this increase had a negative effect on the pyrite oxidation rate and the effectiveness of PCB bioleaching in continuous mode. The bioleaching efficiency of copper from printed circuit boards (PCBs) was above 70% in batch mode and above 80% in continuous mode at PCB concentrations up to 12 g per liter. Copper recovery decreased to around 53.1-61.6% as the PCB concentration continued to increase. The nickel leaching efficiency in batch mode was 46.3 ± 4.8%. In continuous mode, the nickel recovery decreased as the PCB concentration increased, reaching 48.53% in the first stage, then declining to 37.62% in the second stage and finally dropping to 27.06% in the third stage, depending on the higher concentration of PCB.