Abstract
The inherent Gaussian intensity distribution of laser beams causes critical issues such as ablation, spattering, and porosity during laser sintering and melting. Although modulating the intensity distribution by a beam shaper can alleviate these problems, it suffers from high cost, limited durability, and significant energy loss. To address these challenges, we propose a thickness-matching strategy that aligns film geometry with the laser intensity profile. Mathematical analysis provides the optimal thickness distribution, while inkjet printing with computable parameters enables curved circuits with ideal profiles. The curved profile strategy demonstrates enhanced performance in both semiconducting and metallic circuits. For indium tin oxide (ITO) conductive glass, up to a 3.8-fold improvement in conductance and a 5.1% increase in transmittance are achieved compared with planar circuits, while for copper (Cu) conformal circuits, the electrical conductivity is improved by 160% compared with planar circuits. This work establishes a practical additive manufacturing route for high-performance conformal circuits.