Abstract
This paper addresses the challenge of producing lightweight, low-cost, and highly functional devices and components for the electronics industry. To tackle this issue, functionally graded materials consisting of a polymer base and a metallic conductive layer were developed. Technology for producing functionally graded materials was created and optimized. To evaluate the influence of key process parameters on the functional and mechanical properties of the composites, three-dimensional models were constructed and mathematical equations were formulated. The continuity and thickness of the surface layer were examined, the dielectric properties of the polymer material were measured, the resistance of the conductive surface layer was assessed, and adhesion tests of the surface layer were performed.