Abstract
Improving the conductivity of metal particle inks is a hot topic of scientific research. In this paper, a method for preparing metal-filled particles was proposed. By adding filled particles to the ink, the size distribution of particles could be changed to form a bimodal distribution structure in accordance with Horsfield's stacking model. The filling particles had small volume and good fluidity, which could fill the gaps between the particles after printing and improve its electrical conductivity without significantly changing the metal solid content in the ink. Experimental results show that the silver content of the ink slightly increased from 15 wt% to 16.5 wt% after adding filled particles. However, the conductivity of the ink was significantly improved, and after sintering, the resistivity of the ink decreased from 70.2 μΩ∙cm to 31.2 μΩ∙cm. In addition, the filling particles prepared by this method is simple and has a high material utilization rate, which could be applied to the preparation of other kinds of metal particle inks.