Magnetic-Field-Assisted Scratching Process of Single-Crystal Copper

单晶铜的磁场辅助划痕工艺

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Abstract

Energy-field-assisted cutting exhibits excellent ability to reduce cutting force and improve machining quality. In this study, a magnetic field was applied in an innovative way to aid in the cutting process, and magnetic-field-assisted scratching experiments of single-crystal copper were carried out. It was found that magnetic-field-assisted scratching increased the actual scratching force due to the additional Lorentz force in the cutting process. However, the friction coefficient of the magnetic-field-assisted scratching was reduced by 19.4% due to the tribological modification effect on tool/chip contact. Meanwhile, magnetic-field-assisted scratching was conducive to decreasing the degree of chip deformation, reducing microburrs on the machined surface, and obtaining a surface roughness reduction of an average of 26.8%. The possible reason for this effect was that the presence of a magnetic field in the cutting process promoted the dislocation slip of metal materials. The results indicated that magnetic-field-assisted cutting improves the machinability in the metal cutting process.

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