A Transition Structure from Stripline to Substrate-Integrated Waveguide Based on LTCC

基于低温共烧陶瓷的带状线到基板集成波导的过渡结构

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Abstract

With the advancement of wireless communication technologies into high-frequency millimeter wave and sub-THz bands, conventional transmission lines such as microstrip and stripline face significant limitations. Under the circumstances, along with the increased application of new transmission lines such as substrate-integrated waveguides (SIWs), the design of transition structures between different transmission lines has become a practical requirement in modern signal transmission systems. This paper presents a novel stripline to SIW transition structure. Drawing inspiration from the classical microstrip probe techniques in metal waveguides, the proposed design employs Low-Temperature Co-fired Ceramic (LTCC) technology for both device fabrication and SIW implementation. The developed structure demonstrates a stable performance, structural simplicity, and manufacturing feasibility. Through fabrication and testing, the transition structure can achieve a return loss below -10 dB across the 89-100 GHz frequency range, with an insertion loss of approximately 0.75 dB.

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