Abstract
Cooling is important for AlGaN/GaN high-electron mobility transistors (HEMTs) performance. In this paper, the advantages and disadvantages of the cooling performance of three cooling schemes: remote cooling (R-cool), near-chip cooling (NC-cool), and chip-embedded cooling (CE-cool) are compared. The influences of distinct geometric parameters and operating conditions on thermal resistance are investigated. The results show that the thermal resistances of NC-cool and CE-cool are almost the same as each other. Decreasing microchannel base thickness (h(b)) significantly increases the thermal resistance of CE-cool, and when its thickness is less than a critical value, NC-cool exhibits superior cooling performance than CE-cool. The critical thickness increases when decreasing the heat source pitch (P(h)) and the convective heat transfer coefficient (h(conv)) or increasing the thermal conductivity of the substrate (λ(sub)). Moreover, increasing P(h) or λ(sub) significantly improves the thermal resistance of three cooling schemes. Increasing h(conv) significantly decreases the thermal resistances of NC-cool and CE-cool while hardly affecting the thermal resistance of R-cool. The influence of the boundary thermal resistance (TBR) on the thermal resistance significantly increases at higher λ(sub) and larger h(conv).