Abstract
Design against adhesion in microelectromechanical devices is predicated on the ability to quantify this phenomenon in microsystems. Previous research related the work of adhesion for an adhered microbeam to the beam's unadhered length, and as such, interferometric techniques were developed to measure that length. We propose a new vibration-based technique that can be easily implemented with existing atomic force microscopy tools or similar metrology systems. To make such a technique feasible, we analysed a model of the adhered microbeam using the nonlinear beam theory put forth by Woinowsky-Krieger. We found a new relation between the work of adhesion and the unadhered length; this relation is more accurate than the one by Mastrangelo & Hsu (Mastrangelo & Hsu 1993 J. Microelectromech. S., 2, 44-55. (doi:10.1109/84.232594)) which is commonly used. Then, we derived a closed-form approximate relationship between the microbeam's natural frequency and its unadhered length. Results obtained from this analytical formulation are in good agreement with numerical results from three-dimensional nonlinear finite-element analysis.