Abstract
This paper focuses on the characterization of the physico-chemical properties, surface modification, residual copper content and in situ hybrid inorganic particle modification of polypropylene (PP) composites reinforced by waste printed circuit board powder (WPCBP). A series of WPCBP/SiO(2) hybrids (TSW) were prepared by a sol-gel method at different pH values. Characterization results revealed the in situ generation of SiO(2) on the surface of WPCBP, and showed that with an increase in pH value, the size of SiO(2) particles increased gradually and the copper content decreased in the TSW powder. The mechanical properties, oxidation induction time (OIT) and thermal properties of PP composites were improved by reinforcement with TSW, which might be ascribed to the formation of serrated interfaces. This work not only develops a powerful method to enhance the properties of PP/WPCBP composites, but also provides an environmentally sustainable approach to the high-added-value reutilization of WPCBP.