Abstract
This study is the first one that investigates in detail the bacterial intercellular response to the high density of crystallographic defects including vacancies created in Cu by high pressure torsion. To this aim, samples were deformed by high pressure torsion and afterward, their antibacterial properties against Staphylococcus aureus were analyzed in adhesion tests. As a reference an annealed sample was applied. To avoid the influence of surface roughness, specially elaborated conditions for surface preparation were employed, which do not introduce defects and assure comparable surface roughness. The analysis of the chemical composition and thickness of passive layers by X-ray photoelectron spectroscopy showed that they were comparable for nanostructured and micrograined samples, consisting of Cu2O and CuO, and a thickness of 6 nm. The interface bacterium-substrate was prepared by a focused ion beam and further analyzed by scanning transmission electron microscopy and energy dispersive spectroscopy. High pressure torsion processed Cu shows enhanced anti-adhesion properties while in contact with S. aureus than micrograined Cu. There is a linear correlation between luminous intensity and grain size-0.5. The bacterial intercellular defence mechanism includes the creation of Cu2O nanoparticles and the increased concentration of sulphur-rich compounds near these nanoparticles.