Abstract
Chitosan and bio-based epoxy resins have emerged as promising formaldehyde-free replacements for traditional urea-formaldehyde (UF) adhesives in engineered wood products. This study evaluated five chitosan-to-epoxy weight ratios (3:1, 2:1, 1:1, 1:2, 1:3) as adhesives for hot-pressing medium density fiberboards (MDF) using mixed hardwood fibers. Increasing the epoxy ratio reduced viscosity and gel time, facilitating spraying and fast curing. The density of the formulated MDFs increased with higher epoxy ratios, ranging from 679 kg/m3 for the 3:1 ratio to 701 kg/m3 for the 1:3 formulation, meeting the 500-900 kg/m3 density range specified in EN 323. The 1:3 epoxy-rich formulation enhanced modulus of rupture (MOR) to 31 MPa and modulus of elasticity (MOE) to 2392 MPa, exceeding the minimum requirements of 16 MPa and 1500 MPa set out in EN 310 and EN 316, respectively. Dimensional stability peaked at 5% thickness swelling for the 1:3 formulation after 24 h water soaking, fulfilling the < 25% requirement per EN 316. Internal bond strength reached a maximum of 0.98 MPa for the 3:1 chitosan-rich formulation, satisfying the 0.40 MPa minimum per EN 319. One-way ANOVA tests showed the adhesive ratio had a significant effect on mechanical properties and dimensional stability at 95-99% confidence levels. Duncan's multiple range test revealed the 1:3 ratio boards exhibited statistically significant improvements compared to untreated group. Overall, tailoring the ratios achieved well-balanced properties for MOR, MOE, and dimensional stability, demonstrating potential to replace UF resins.