Abstract
The interfaces between inorganic selective contacts and halide perovskites (HaPs) are possibly the greatest challenge for making stable and reproducible solar cells with these materials. NiO(x), an attractive hole-transport layer as it fits the electronic structure of HaPs, is highly stable and can be produced at a low cost. Furthermore, NiO(x) can be fabricated via scalable and controlled physical deposition methods such as RF sputtering to facilitate the quest for scalable, solvent-free, vacuum-deposited HaP-based solar cells (PSCs). However, the interface between NiO(x) and HaPs is still not well-controlled, which leads at times to a lack of stability and V(oc) losses. Here, we use RF sputtering to fabricate NiO(x) and then cover it with a Ni(y)N layer without breaking vacuum. The Ni(y)N layer protects NiO(x) doubly during PSC production. Firstly, the Ni(y)N layer protects NiO(x) from Ni(3+) species being reduced to Ni(2+) by Ar plasma, thus maintaining NiO(x) conductivity. Secondly, it passivates the interface between NiO(x) and the HaPs, retaining PSC stability over time. This double effect improves PSC efficiency from an average of 16.5% with a 17.4% record cell to a 19% average with a 19.8% record cell and increases the device stability.