Abstract
Low-viscosity epoxy-containing diluents are used to reduce the initial viscosity of highly filled, wear-resistant epoxy systems and to improve filler wetting and dispersion. This study determined physical parameters by an atomic-increment approach and electronic descriptors using the Parametric Method 3 (PM3) semi-empirical method. Clear relationships were established between the effective molar cohesion energy and the solubility parameter with van der Waals volume. Linear dependencies were also obtained between the diluent surface tension and spreading coefficients on model high-hardness fillers, including silicon carbide, boron carbide, and normal corundum. The activity of epoxy diluents depends on the lowest unoccupied molecular orbital energy. These diluents influence processing and the final physical and mechanical properties of composites, making their selection critical for strength, hardness, and wear resistance. Computational analysis enables prediction of diluent behavior, reducing experimental time and cost. Integrating physical and quantum-chemical data into epoxy diluent design accelerates the search for optimal components and improves production of durable, high-performance epoxy composites.