Abstract
To prepare high-temperature-resistant dielectric composite films, a novel three-dimensional nanofiller was fabricated using carboxylated polyarylene ether nitrile as a bridge, which tightly loads BaTiO(3) nanoparticles onto WS(2) nanosheets (WS(2)@BT) via in situ chemical bonding. Afterward, the WS(2)@BT nanofiller was introduced into the polyarylene ether nitrile (PEN) matrix, and high-temperature heat treatment was performed to form a crosslinked network, yielding CPEN/WS(2)@BT nanocomposites. Notably, the modified WS(2)@BT effectively improves the compatibility between the nanoparticles and the PEN matrix, which is superior to the compatibility of unmodified nanofillers with the matrix. Moreover, after crosslinking, CPEN/WS(2)@BT exhibits excellent comprehensive performance: when the filler content is 30 wt%, its glass transition temperature (T(g)) reaches 257.83 °C, significantly higher than that of PEN/WS(2)@BT, and its dielectric constant is 193% higher than that of pure CPEN. In addition, the dielectric temperature coefficient remains below 1 × 10(-3) °C(-1) in the range of 25-220 °C. Overall, this work provides an effective and reliable strategy for preparing high-performance, high-temperature-resistant composite dielectric films.