Abstract
The degradation behavior and mechanism of perfluoroelastomer (FFKM) in the acidic Standard Clean 2 (SC2) solutions were studied to facilitate their application in semiconductor Radio Corporation of America (RCA) cleaning processes. The results indicate significant degradation of the mechanical properties of FFKM in the SC2 solution, characterized by surface pitting and particle formation, accompanied by progressive destruction of the cross-linked network. FTIR and XPS analyses revealed that degradation primarily occurs in the Trialkyl isocyanurate (TAIC) cross structure, while the main chain and side groups remain stable. HCl-induced acid hydrolysis and H(2)O(2)-induced oxidation act synergistically to break down the cross-link structures. This degradation compromised the filler matrix interface, leading to filler release and a consequent progressive deterioration of the overall properties of FFKM. This work elucidates the degradation mechanism of the FFKM in acidic environments, providing a scientific basis for the reliable design and lifetime prediction of FFKM components in semiconductor wet processes.