Development and Interfacial Mechanism of Epoxy Soybean Oil-Based Semi-Liquid Gel Materials for Wellbore Sealing Applications

用于井筒密封的环氧大豆油基半液态凝胶材料的开发及界面机理研究

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Abstract

In this study, a novel semi-liquid gel material based on bisphenol A-type epoxy resin (E51), methylhexahydrophthalic anhydride (MHHPA), and epoxidized soybean oil (ESO) was developed for high-performance wellbore sealing. The gel system exhibits tunable gelation times ranging from 1 to 10 h (±0.5 h) and maintains a low viscosity of <100 ± 2 mPa·s at 25 °C, enabling efficient injection into the wellbore. The optimized formulation achieved a compressive strength exceeding 112.5 ± 3.1 MPa and a breakthrough pressure gradient of over 50 ± 2.8 MPa/m with only 0.9 PV dosage. Fourier transform infrared spectroscopy (FTIR) confirmed the formation of a dense, crosslinked polyester network. Interfacial adhesion was significantly enhanced by the incorporation of 0.25 wt% octadecyltrichlorosilane (OTS), yielding an adhesion layer thickness of 391.6 ± 12.7 nm-approximately 9.89 times higher than that of the unmodified system. Complete degradation was achieved within 48 ± 2 h at 120 °C using a γ-valerolactone and p-toluenesulfonic acid solution. These results demonstrate the material's potential as a high-strength, injectable, and degradable sealing solution for complex subsurface environments.

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