Analysis of the Impact of Fabric Surface Profiles on the Electrical Conductivity of Woven Fabrics

分析织物表面形貌对机织物导电性的影响

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Abstract

The surface profile and structural alignment of fibers and yarns in fabrics are critical factors affecting the electrical properties of conductive textile surfaces. This study aimed to investigate the impact of fabric surface roughness and the geometrical parameters of woven fabrics on their electrical resistance properties. Surface roughness was assessed using the MicroSpy(®) Profile profilometer FRT (Fries Research & Technology) Metrology™, while electrical resistance was evaluated using the Van der Pauw method. The findings indicate that rougher fabric surfaces exhibit higher electrical resistance due to surface irregularities and lower yarn compactness. In contrast, smoother fabrics improve conductivity by enhancing surface uniformity and yarn contact. Fabric density, particularly weft density, governs the structural alignment of yarns. A 35% increase in weft density (W19-W27) resulted in a 13-15% reduction in resistance, confirming that denser fabrics facilitate current flow. Higher weft density also increases directional resistance differences, enhancing anisotropic behavior. Angular distribution analysis showed lower resistance and greater anisotropy at perpendicular orientations (0° and 180°, the weft direction; 90° and 270°, the warp direction), while diagonal directions (45°, 135°, 225°, and 315°) exhibited higher resistance. Surface roughness further hindered current flow, whereas increased weft density and surface mass reduced resistance and improved the directional dependencies of the electrical resistances. This analysis was conducted based on research using woven fabrics produced from silver-plated polyamide yarns (Shieldex(®) 117/17 HCB). These insights support the optimization of these conductive fabrics for smart textiles, wearable sensors, and e-textiles. Fabric variants W19 and W21, with lower resistance variability and better isotropic behavior under the S electrode arrangement, could be proposed as suitable materials for integration into compact sensing systems like heart rate or bio-signal monitors.

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