Abstract
This study achieved the successful creation of a 6061/M21/6061 composite sheet, with Cu powder incorporated in the middle, through a two-pass hot roll bonding process. The effect of Cu powder addition on interface microstructure evolution of Mg-Al composite plate during annealing was studied. The results show that the incorporation of copper powder significantly suppresses the formation of Mg-Al intermetallic compounds (IMCs) at the boundary of Al-Mg bonded plates. The IMCs' thickness of composite plate Mg-Al interface absent Cu powder increased from 7.0 µm at 250 °C to 61.2 µm at 400 °C, showing a rapid growth trend. On the contrary, in the area with Cu powder of composite plate containing Cu powder, when the temperature ranges from 250 °C to 350 °C, the Mg-Al diffusion layer is thin and only varies between 1 µm and 3.2 µm and, even when the temperature rises to 400 °C, the diffusion layer is only 18.8 µm. At a constant temperature, the diffusion rate of IMCs in the Cu powder-containing region of the composite plate is significantly lower than that in the region without Cu powder. Upon the addition of Cu powder, Al(2)Cu and Al(0.92)Cu(1.08)Mg phases are formed, which decrease the proportion of the brittle phases Al(3)Mg(2) and Mg(17)Al(12) at the composite plate interface, thereby effectively mitigating the diffusion of IMCs within the Mg-Al interface. This presents a novel concept for the investigation of enhanced interface bonding and the fabrication of Mg-Al composite plates.