Abstract
With the growing integration of electronic systems into modern infrastructure, the need for effective electromagnetic interference (EMI) shielding materials has intensified. This study explores the development of electroless Ni-plated fiber composites and systematically investigates the effects of post-heat treatment on their electrical, structural, and interfacial performance. Both carbon fibers (CFs) and glass fibers (GFs) were employed as reinforcing substrates, chosen for their distinct mechanical and thermal characteristics. Ni plating enhanced the electrical conductivity of both fibers, and heat treatment facilitated phase transformations from amorphous to crystalline Ni(3)P and Ni(2)P, leading to improved EMI shielding effectiveness (EMI-SE). NGF-based composites achieved up to a 169% increase in conductivity and a 116% enhancement in EMI-SE after treatment at 400 °C, while NCF-based composites treated at 800 °C attained superior conductivity and shielding performance. However, thermal degradation and reduced interfacial shear strength (IFSS) were observed, particularly in GF-based systems. The findings highlight the importance of material-specific thermal processing to balance functional performance and structural reliability. This study provides critical insights for designing fiber-reinforced composites with optimized EMI shielding properties for application-driven use in next-generation construction materials and intelligent infrastructure.