Abstract
In this study, the bipolar resistance switching behavior and electrical conduction transport properties of a neodymium oxide film's resistive random access memory (RRAM) devices for using different top electrode materials were observed and discussed. Different related electrical properties and transport mechanisms are important factors in applications in a film's RRAM devices. For aluminum top electrode materials, the electrical conduction mechanism of the neodymium oxide film's RRAM devices all exhibited hopping conduction behavior, with 1 mA and 10 mA compliance currents in the set state for low/high voltages applied. For TiN and ITO (Indium tin oxide) top electrode materials, the conduction mechanisms all exhibited ohmic conduction for the low voltage applied, and all exhibited hopping conduction behavior for the high voltage applied. In addition, the electrical field strength simulation resulted in an increase in the reset voltage, indicating that oxygen ions have diffused into the vicinity of the ITO electrode during the set operation. This was particularly the case in the three physical models proposed, and based on the relationship between different ITO electrode thicknesses and the oxygen ion concentration distribution effect of the neodymium oxide film's RRAM devices, they were investigated and discussed. To prove the oxygen concentration distribution expands over the area of the ITO electrode, the simulation software was used to analyze and simulate the distribution of the electric field for the Poisson equation. Finally, the neodymium oxide film's RRAM devices for using different top electrode materials all exhibited high memory window properties, bipolar resistance switching characteristics, and non-volatile properties for incorporation into next-generation non-volatile memory device applications in this study.