Abstract
Photopolymerization is a ubiquitous, indispensable technique widely applied in applications from coatings, inks, and adhesives to thermosetting restorative materials for medical implants, and the fabrication of complex macro-scale, microscale, and nanoscale 3D architectures via additive manufacturing. However, due to the brittleness inherent in the dominant acrylate-based photopolymerized networks, a significant need exists for higher performance resin/oligomer formulations to create tough, defect-free, mechanically ductile, thermally and chemically resistant, high modulus network polymers with rapid photocuring kinetics. This study presents densely cross-linked triazole-based glassy photopolymers capable of achieving preeminent toughness of ≈70 MJ m(-3) and 200% strain at ambient temperature, comparable to conventional tough thermoplastics. Formed either via photoinitiated copper(I)-catalyzed cycloaddition of monomers containing azide and alkyne groups (CuAAC) or via photoinitiated thiol-ene reactions from monomers containing triazole rings, these triazole-containing thermosets completely recover their original dimensions and mechanical behavior after repeated deformations of 50% strain in the glassy state over multiple thermal recovery-strain cycles.