Fission yeast CK1 promotes DNA double-strand break repair through both homologous recombination and non-homologous end joining

裂殖酵母 CK1 通过同源重组和非同源末端连接促进 DNA 双链断裂修复

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作者:Sierra N Cullati, Eric Zhang, Yufan Shan, Rodrigo X Guillen, Jun-Song Chen, Jose Navarrete-Perea, Zachary C Elmore, Liping Ren, Steven P Gygi, Kathleen L Gould

Abstract

The CK1 family are conserved serine/threonine kinases with numerous substrates and cellular functions. The fission yeast CK1 orthologues Hhp1 and Hhp2 were first characterized as regulators of DNA repair, but the mechanism(s) by which CK1 activity promotes DNA repair had not been investigated. Here, we found that deleting Hhp1 and Hhp2 or inhibiting CK1 catalytic activities in yeast or in human cells activated the DNA damage checkpoint due to persistent double-strand breaks (DSBs). The primary pathways to repair DSBs, homologous recombination and non-homologous end joining, were both less efficient in cells lacking Hhp1 and Hhp2 activity. In order to understand how Hhp1 and Hhp2 promote DSB repair, we identified new substrates using quantitative phosphoproteomics. We confirmed that Arp8, a component of the INO80 chromatin remodeling complex, is a bona fide substrate of Hhp1 and Hhp2 that is important for DSB repair. Our data suggest that Hhp1 and Hhp2 facilitate DSB repair by phosphorylating multiple substrates, including Arp8.

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